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      Thermal Management Solutions

      Why Thermal Management

      To operate efficiently and ensure reliability, heat must be removed from heat generating power components.

      As a result of faster speeds, reduced format, and more devices being populated on PCB’s, more heat is being generated that must be removed for efficient operation. The move to sustainable energy increased the demand for energy management electronics, which also create much heat because of the high electrical currents used in these applications (power inverters for solar and wind energy, powertrain electronics for HEV, etc).

      Thermal Management, through various applications, aids in directing heat away from heat generating system components.

      Typical applications for Thermal Management may include:

      Power Applications

      • Power amplifiers
      • DC power supplies
      • Power control systems
      • RF & MW applications

      Automotive

      • Motor control modules
      • Electric brake system
      • Power-train in EV

      High Speed Computing

      LED

      • Lighting systems - Automotive, Industrial, Consumer

      TTM's Thermal Management Solutions

      TTM offers a wide range of Thermal Management types to include Via Farms, Heatsinks/Pallets, Heatsink Coins, Embedded Coins, E-Coin, Press Fit Coin (PFC), Metal In-lay and Solder or Adhesive attach.

      Additionally, TTMs' Thermal Management Solutions include our patented embedded E-Coin technology along with heatsink coin attachment capabilities and heavy copper. Our expertise in RF & Microwave is unmatched in the industry.


      Via Farms

      Via Farms



      Press Fit Coin (PFC) Technology

      Press Fit Coin (PFC) Technology



      E Coin Technology

      E Coin Technology



      Heatsinks

      Heatsinks



      Metal In-lay

      Metal In-lay



      Solder or Adhesive Attach

      Solder or Adhesive Attach

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